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sureCore teams up with Sarcina to package cryo chips

sureCore recently announced the launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes.

Now the company has revealed that it has teamed up with packaging experts, Sarcina, who have designed a custom package specifically for use at cryogenic temperatures.

Commenting Paul Wells, sureCore’s CEO, said that the agreement represented another critical step in the company’s programme to make Cryo-CMOS available for the Quantum Computing (QC) ecosystem.

Full article on NewElectronics