CES 2024 showed how AI is becoming pervasive in a huge range of products making them smarter, safer and feature rich. To run these AI workloads requires significant compute power which in turn requires considerable amounts of embedded memory integrated on chip as close to the compute units as possible to reduce latency. Delivering the inferencing power that users now expect requires massively parallel processing arrays which means not only increased power consumption, but also ever challenging thermal loads placing demands on packaging and cooling needs. SureCore has revisited its PowerMiser IP and further optimised it to drive down dynamic power further as well as exploiting the power efficiencies of FinFET technology. This has delivered a memory technology that minimises thermal impact whilst delivering the demanding performance profile needed by AI and has called it “PowerMiser AI”. Full article on Electronics for Engineers